MG Chemicals 4900P-25G, 25 gram (0.88 oz.) Syringe of SAC305 Lead Free No Clean Solder Paste

MG Chemicals 4900P-25G, 25 gram (0.88 oz.) Syringe of SAC305 Lead Free No Clean Solder Paste

Mg Chemicals
  • $19.95
  • 3 in stock

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Product Description

  • SKU: 95445
  • Vendor: Mg Chemicals
  • UPC: 779008490075
  • Condition: New

The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux. This lead-free and halogen-free solder paste is designed for extreme flux activity and enhanced printing characteristics needed for ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

Applications & Usages

The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm.

Features:

  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Repeatable and consistent print characteristics
  • Long stencil and tack life to accommodate high speed printing
  • Excellent wettability
  • Suitable for air or nitrogen atmosphere
  • Medium soft, non-cracking residues
  • Dobb-Frank (DRC conflict free)
  • REACH (compliant)
  • RoHS (compliant)

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